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Precautions for soldering
With the continuous progress of the times, many manufacturers have such technologies as SMT chip processing. Such technologies have received great repercussions, but there are some problems that need attention. For example, there are many precautions in soldering. :
The process of SMT patch processing welding heating bridge is not correct. The soldering thermal bridge in SMT chip processing is to prevent the solder from forming a bridge. If this process is improperly operated, it will cause cold solder joints or solder flow to be insufficient. Therefore, the correct soldering method should be to place the soldering iron head between the pad and the foot position, the tin wire is close to the soldering iron head, move the tin wire to the opposite side when the tin melts, or place the tin wire between the pad and the pin In the meantime, the soldering iron is placed on the tin wire, and when the tin is melted, the tin wire is moved to the opposite side; in this way, good solder joints can be generated to prevent adverse effects on the processing of the patch.
SMT patch processing transfer welding operation is improper. Transfer soldering refers to adding solder to the tip of the soldering iron and then transferring it to the connection. Improper transfer welding will damage the tip of the soldering iron and cause poor wetting. So the normal transfer soldering method should be the tip of the soldering iron placed between the pad and the pin, the tin wire is close to the tip of the soldering iron, and the tin wire is moved to the opposite side when the tin melts. Place the tin wire between the pad and the pin. Place the soldering iron on top of the tin wire, and move the tin wire to the opposite side when the tin melts.
Which is better for SMT patch processing
SMT chip processing flux used improperly. According to relevant statistics, many staff are used to using too much flux in the process of SMT patch processing. In fact, this not only does not help you get a good solder joint, but also easily causes the problem of whether the lower solder foot is reliable. It is easy to cause corrosion, electron transfer and other problems.
SMT patch processing temperature setting is incorrect. Temperature is also an important factor in the soldering process. If the temperature is set too high, the pad will be lifted, the solder will be overheated and the circuit patch will be damaged. Therefore, setting the correct temperature is particularly important for the quality assurance of patch processing.
When processing SMT, the lead is soldered too hard. Many SMT chip processing plant staff believe that excessive force can promote the heat conduction of the solder paste and speed up the soldering effect, so they are used to pressing down hard during soldering. In fact, this is a bad habit, and it is easy to cause problems such as lifting, delamination, depression, PCB white spots and so on. Therefore, it is not necessary to apply too much force during the soldering process. In order to ensure the quality of the chip processing, you only need to gently touch the soldering iron tip to the pad.
SMT贴片加工的拼装相对密度高、电子元器件重量轻、重量轻，贴片元器件的体积和总重量只有传统式插装元器件的1/10左右，通常选用SMT以后，电子元器件体积变小40%~60%，总重量减少60%~80%。 可靠性高、抗振能力强。点焊缺陷率低。高频性能好。降低了电磁和射频干扰。 便于实现自动化技术，提升生产率。控制成本可达30%~50%。 节约原材料、电力能源、机器设备、人力资源、时长这些。